Researcher/ Engineer (Chemical/ Electrical/ Materials): Semiconductor Electroplating / Packaging Solutions DOCTECH HK LIMITEDHong Kong SAROn-site Full Time Associate Dear Researcher Fellow, Welcome! We are Doctech HK Ltd., a company dedicated to the development of various hybrid copper materials, especially for the applications of future three-dimensional integrated circuit (3 DIC) packaging. Currently, we are seeking a highly motivated and R&D-focused individual to fill the position of Senior Engineer, located in Hong Kong. Researcher Position in Chemistry and Material Science at Doctech Are you a talented and driven researcher with a chemistry, Electrical, material science, or related field background? Are you passionate about developing innovative electroplating solutions for advanced semiconductor packaging? If so, Doctech invites you to join our research team as we push the boundaries of technology and materials science. About Us Doctech is a pioneering company specializing in surface metal treatment technologies, chemical additives, and advanced materials for semiconductor packaging. We develop cutting-edge solutions that meet the needs of the ever-evolving 3 D IC packaging and electronics industries. Position: Researcher – Electroplating / Packaging Solutions Key Responsibilities : Lead the research and development of electroplating solutions for surface metal treatments, focusing on advanced additive formulations. Conduct in-depth material characterization and performance analysisof electroplated metals. Collaborate with the R&D team to innovate and optimize formulations to improve metal deposition quality, conductivity, and stability. Design and execute experiments to test electrochemical properties and develop novel methodologies for enhanced metal adhesion and materials stability. Provide technical guidance and support for scale-up processes from laboratory to production. Qualifications : Master degree or above in Chemistry, Electrical, Material Science Engineering, or a related field. Proven experience in electrochemistry, particularly in the development of electroplating solutions. Expertise in materials analysis techniques and other related testing methodologies. Strong laboratory skills, with experience in metal deposition and surface treatment technologies. Ability to work in a collaborative, fast-paced environment while managing multiple research projects. Why Join Us?Be at the forefront of innovation in semiconductor packaging technologies. Work with a highly experienced and collaborative team of experts in material science and electrochemistry. Opportunity to publish patents in a high-impact technology area. Competitive salary and benefits package. Additional Information Job Level Associate Publish Date15/01/2025 Job Ref. No. R25 Master Degree Job Function Chemical Engineering Electrical / Electronic Engineering Company Overview Doctech HK Limited is a semiconductor company adopting a newly developed nano-twin copper material especially for the applications of three-dimensional integrated circuit (3 DIC) packing. Doctech focuses on the development and commercialisation of nt-Cu as a promising nanomaterial in redistribution layers (RDLs), Cu interconnects and micro-pillar for consumer electronics. Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability and to provide solutions and platform technologies. The nt-Cu material features a promising Cu-Cu bonding technology, which can provide a lower interfacial resistance, making it an ideal technology for the future hybrid Cu-Cu bonding of monolithic three-dimensional (M3 D) ICs packing. Company Overview Doctech HK Limited is a semiconductor company adopting a newly developed nano-twin copper material especially for the applications of three-dimensional integrated circuit (3 DIC) packing. Doctech focuses on the development and commercialisation of nt-Cu as a promising nanomaterial in redistribution layers (RDLs), Cu interconnects and micro-pillar for consumer electronics. Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability and to provide solutions and platform technologies. The nt-Cu material features a promising Cu-Cu bonding technology, which can provide a lower interfacial resistance, making it an ideal technology for the future hybrid Cu-Cu bonding of monolithic three-dimensional (M3 D) ICs packing.
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