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Job Responsibilities

Responsible for 800 G/1.6 T and above module-level MB or EVB test board, RF channel routing planning, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer.
Responsible for 128 Gbaud and above component-level EVB test board, connector selection, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer.
Responsible for all RF simulation items of various projects, including 3 D EM modeling, RF optimization of each RF interface, passive channel simulation, and full channel simulation with chip electrical models, post-simulation confirmation, and RF simulation report for cross-department review. Some projects may have tight schedules.
Responsible for channel simulation of RF performance comparison for different chips or parameter configurations in electrical models.
Responsible for various EVB/MB/FPC performance confirmations through RF testing.
Responsible for locating RF-related problems during product testing, cause investigations, including RMA.
Collaborate with cross-departmental teams at different sites, communicate technical issues, and participate in project plan evaluations to ensure smooth completion.
Provide RF technical support for various platforms, including RF technology communication with PCB/FPC/PKG/connector/chip vendors, RF technology improvements for new products with smaller signal pitch and higher bandwidth, and learning new RF technologies.

Qualifications and Requirements

Bachelor/Master or above in electronic information engineering, communication engineering, microwave technology, or related majors; familiar with signal integrity and microwave theory.
At least 5 years of experience in high-speed optical-electronics products; experience with 800 G/1.6 T module MB simulation and optimization is preferred.
Familiar with at least one 3 D EM field solver tool (e.g., HFSS, CST, EMpro), capable of independent 3 D EM modeling and RF performance optimization.
Familiar with at least one channel simulation solver tool (e.g., ADS, Circuit), capable of connecting channel simulation models and generating results for different parameters.
Knowledge of PCB materials, impedance calculation, and PCB stack-up definitions, able to select materials and define stack-ups for various projects.
Experience with lab instruments such as TDR, PNA, Probe, including calibration and data analysis; RF problem analysis and location skills are preferred.
Ability to evaluate RF schemes independently and communicate technical issues across departments, including pre- and post-simulation reviews.
Fluent in English (listening, speaking, reading, and writing).

We are an equal opportunity employer and value diversity. We do not discriminate based on race, religion, color, national origin, sex, gender, sexual orientation, age, marital status, veteran status, or disability. Reasonable accommodations will be provided for individuals with disabilities.
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